Ball grid array packages hide their solder joints beneath the body. Package selection, land pattern, board construction and inspection strategy should be reviewed together before release.

Provide the package evidence

Identify exact package and part numbers, pitch, ball layout and moisture handling information. Supply the manufacturer drawing and any assembly recommendations relevant to the chosen device. Board warpage, via structures and surrounding component clearances can influence the process review.

Specify what inspection must demonstrate

Optical inspection cannot directly view most BGA solder joints. Ask the supplier to explain the proposed hidden-joint inspection coverage and limitations, including whether the equipment and method are suitable for the package. Do not treat an X-ray image by itself as proof of full electrical function.

Plan test and rework boundaries

Define functional checks that exercise the intended interfaces and operating conditions. State whether rework is permitted, how it is approved and what records are needed afterwards. Sensitive packages and complex boards may require a project-specific rework decision rather than an assumed standard repair path.